Sunday, 26 June 2011

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Familarization: Components and Parts on iPhone Mobile Phone Handsets

An apple iphone 3GS teardown and analysis is also a big help on overviewing what inside on it.

Apple “surprised” us early this month with the announcement of it iPhone 3G “s”. Whenever Apple releases a new device – everyone and their brother/sister has to get involved.
Dr. Wreck is no exception and has been working hard with the gentlemen/women over at ifixit to get the skinny on the new device. Without further ado, here we go!

Explosion - courtesy of ifixit
Explosion - courtesy of ifixit
Those Apple Engineer’s really know how to pack a PCB. They’ve managed to fit almost everything onto the “top” of the main logic board. The 3Gs’ PCB makes the 3G’s PCB look sparse (the apostrophes were probably a little bit confusing there).
logicboardPCB
Let’s take a minute here to talk about the new Applications Processor Core. Apple has chosen to go from the ARM 11 Samsung S3C6400 to the ARM A8 Samsung S5PC100 with this device.



iPhone 3Gs Block Diagram - In Progress
iPhone 3Gs Block Diagram - In Progress
This is the single largest difference between the 3G and the 3Gs. Firstly the manufacturing process has been chopped from 90nm to 65nm. Pipeline depth has been boosted to 13 – stage from 8. More importantly the clock speed of this newer processor rolls in at 600MHz – opposed to the 412MHz core of the old – obsolete :) 3G. Samsung has also doubled the quantity of L1 cache from 16 to 32KB.
None of this even takes the new PowerVR graphics core into consideration. Apple is clearly thinking along the lines of a gaming device for this puppy. The SGX is fully programmable – like the graphics card on your PC or mac. Expect some sweet gaming action in the near future.
@ 200MHz the SGX can pop 7M triangles/second and render 250M pixels/sec. That’s roughly 7 times the performance of the old, “obsolete” MBX.
It’s kind of like comparing your old 486 to a Pentium.

Logic1

Let’s take a minute here to talk about the new Applications Processor Core. Apple has chosen to go from the ARM 11 Samsung S3C6400 to the ARM A8 Samsung S5PC100 with this device.
iPhone 3Gs Block Diagram - In Progress
iPhone 3Gs Block Diagram - In Progress
This is the single largest difference between the 3G and the 3Gs. Firstly the manufacturing process has been chopped from 90nm to 65nm. Pipeline depth has been boosted to 13 – stage from 8. More importantly the clock speed of this newer processor rolls in at 600MHz – opposed to the 412MHz core of the old – obsolete :) 3G. Samsung has also doubled the quantity of L1 cache from 16 to 32KB.
None of this even takes the new PowerVR graphics core into consideration. Apple is clearly thinking along the lines of a gaming device for this puppy. The SGX is fully programmable – like the graphics card on your PC or mac. Expect some sweet gaming action in the near future.
@ 200MHz the SGX can pop 7M triangles/second and render 250M pixels/sec. That’s roughly 7 times the performance of the old, “obsolete” MBX.
It’s kind of like comparing your old 486 to a Pentium.
Logic1

Bottom of PCB - WiFi/Bluetooth Combo
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