Friday, 24 June 2011

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Apple iPhone 4 Disassemble Instruction Guide

The phone uses the 1 GHz ARM Cortex A8 core, much like its bigger sibling, the iPad.

 * Unlike the iPhone 3GS and iPad -- which are both equipped with 256 MB of RAM -- the iPhone 4 has a whopping 512 MB.

 * The AGD1 is the new 3 axis gyroscope that we believe is designed and manufactured by ST Micro for Apple. The package marks on this device do not appear to be the currently available commercial part, L3G4200D.

 * In what can only be described as a work of genius, Apple has integrated the UMTS, GSM, GPS, Wi-Fi, and Bluetooth antennas into the stainless steel inner frame.

* Broadcom provides both a BCM4329FKUBG 802.11n with Bluetooth 2.1 + EDR and FM receiver and a BCM4750IUB8 single-chip GPS receiver.
* We've identified chips from Broadcom, Cirrus Logic, Numonyx, Samsung, ST Micro, Skyworks, Texas Instruments, and TriQuint.

Here's a teardown with analysis from ifixit.

http://s1.guide-images.ifixit.net/igi/kUEKB6Y2Ah5OIfAh.medium
The teardown:
http://www.ifixit.com/Teardown/iPhone-4-Teardown/3130/1


iPhone 4 all torn down:
http://s1.guide-images.ifixit.net/igi/kUEKB6Y2Ah5OIfAh.huge

Disconnecting logic board connectors:
http://s2.guide-images.ifixit.net/igi/AhMYpVQZs4HfRJaG.huge

Taking out the camera:
http://s1.guide-images.ifixit.net/igi/YJLZ65WWLGtCugsU.huge

Removing the logic board:
http://s1.guide-images.ifixit.net/igi/4LvvhPsqKcwvkRE5.huge

Separating display from frame:
http://s2.guide-images.ifixit.net/igi/iDQNYymGn3MyxCRR.huge

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